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[China Instrument Network Instrument Conference] Recently, China Electronics Technology Standardization Institute held a standardization forum for integrated circuits and packaging technology in Hangzhou, Zhejiang Province. The forum received strong support from the Zhejiang Economic Commission.
Integrated circuit packaging, also known as IC packaging, is to package or seal an integrated circuit chip with plastic or ceramic to form a housing, which protects the chip from external influences, so that the chip can work stably and reliably under various environments and working conditions. At present, for the market demand, the development trend of integrated circuit packaging technology is mainly high density, high speed, high reliability, diversification and environmental protection. At the same time, the productivity is also the development trend of IC packaging industry.
During the discussion, the experts mainly focused on keywords such as "innovation," "integration," and "standards," and analyzed and summarized the development of the integrated circuit industry in 2015. Last year, the entire industry's sales increased by 26.5% year-on-year. Experts predict that during the 13th Five-Year Plan period, under the leadership of China Manufacturing 2025 and the “Internet Plus†strategy, the IC industry will usher in new opportunities for development.
Integrated circuit packaging advances with the development of integrated circuits. With the continuous development of various industries such as military, aerospace, and machinery, the whole machine is also developing in the direction of multi-function and miniaturization, which requires the integration of integrated circuits. The higher the performance, the more complex the function is and the more responsive the integrated circuit package is. At the same time, the high functionality, high performance, miniaturization, and thinness of electronic machine products have promoted the development of integrated circuit packaging technology.
At present, integrated circuit packaging technology has been highly valued by countries around the world. The US government spends a large sum of money each year to fund research on electronic device packaging technology. At this forum, it was precisely under this trend that in-depth discussions were held on the standardization of IC packaging technology. Technical experts and representatives from Xi'an University of Electronic Science and Technology, China Electronics and China University of Science and Technology, and China University of Technology attended the forum. The atmosphere was warm and the forum achieved A complete success.
Integrated circuit packaging, also known as IC packaging, is to package or seal an integrated circuit chip with plastic or ceramic to form a housing, which protects the chip from external influences, so that the chip can work stably and reliably under various environments and working conditions. At present, for the market demand, the development trend of integrated circuit packaging technology is mainly high density, high speed, high reliability, diversification and environmental protection. At the same time, the productivity is also the development trend of IC packaging industry.
During the discussion, the experts mainly focused on keywords such as "innovation," "integration," and "standards," and analyzed and summarized the development of the integrated circuit industry in 2015. Last year, the entire industry's sales increased by 26.5% year-on-year. Experts predict that during the 13th Five-Year Plan period, under the leadership of China Manufacturing 2025 and the “Internet Plus†strategy, the IC industry will usher in new opportunities for development.
Integrated circuit packaging advances with the development of integrated circuits. With the continuous development of various industries such as military, aerospace, and machinery, the whole machine is also developing in the direction of multi-function and miniaturization, which requires the integration of integrated circuits. The higher the performance, the more complex the function is and the more responsive the integrated circuit package is. At the same time, the high functionality, high performance, miniaturization, and thinness of electronic machine products have promoted the development of integrated circuit packaging technology.
At present, integrated circuit packaging technology has been highly valued by countries around the world. The US government spends a large sum of money each year to fund research on electronic device packaging technology. At this forum, it was precisely under this trend that in-depth discussions were held on the standardization of IC packaging technology. Technical experts and representatives from Xi'an University of Electronic Science and Technology, China Electronics and China University of Science and Technology, and China University of Technology attended the forum. The atmosphere was warm and the forum achieved A complete success.
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