Sequential Inductively Coupled Plasma Emission Spectrometer-Icp-Oes/Icp-AES

  • Model NO.: ICP2060T
  • Structure: Desktop
  • Certification: CE, ISO, RoHS
  • Type: Measurement Type
  • Transport Package: Standard International Packing
  • HS Code: 90273000
  • Customized: Customized
  • Material: Steel
  • Application: School, Hosipital, Lab
  • Trademark: skyray instrument
  • Origin: Jiangsu China
ICP 2060T Sequential Inductively Coupled Plasma Emission Spectrometer is designed to measure major and trace elements in various samples with outstanding performance,it was widely applied in various fields ranging from rare earth,geology,metallurgy,chemistry,environmental,clinical medicine,petroleum products,semiconductors,foods

Features:

1. elements ranges: it is able to analysis Over 70 elements
2.Fast analysis: 5-8 elements per minute
3.Excellent detection limits:at ppb level for most elements
4.Wide linear dynamic range:reaching 6 orders of magnitude,from ppb to percentage
5.Lower gas consumption:Each argon gas cylinder can be used for 8 hours
6.Wide wavelength range:
190nm to 500nm with 3600 line grating
190nm to 800nm with 2400 line grating
7.Computer controlled plasma platform optimizes the viewing position to reduce interferences,improve SNR and minimize background emissions
8.he brand new robust free-running,27.12 MHz RF generator that delivers unsurpassed performanc
Sequential Inductively Coupled Plasma Emission Spectrometer-Icp-Oes/Icp-AES


 

Jin Yuankang vacuum sputtering, usually refers to the magnetron sputtering, belongs to the high speed low temperature sputtering method. The process of vacuum around 1 * 10-3Torr, 1.3 * 10-3Pa vacuum argon filled with inert gas (Ar), and the plastic substrate (anode) and metal material (cathode) between the plus due to high voltage DC glow discharge (glow, discharge) electron excitation produced by inert gas, plasma, plasma metal target atomic bomb, deposited on the plastic substrate. Compared with the commonly used sputtering deposition, sputtering and plating adhesion with substrate of strong adhesion than the high evaporation. More than 10 times, the advantages of uniform plating density. The vacuum evaporation need to make metal or metal oxide is vaporized, and the heating temperature is not too high, otherwise, the metal deposited on plastic substrate and exothermic gas Burn the plastic substrate. Several sputtered particles are not affected by gravity, the target and the substrate position can be freely arranged, film forming the initial nucleation density is high, the production of thin continuous film 10nm below the target, long service life, long time continuous production automation.

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